Direct-to-Chip Cooling
VÄLJA DEN PERFEKTA KYLNINGSLÖSNINGEN
Kylning direkt till chippet är en banbrytande metod för termisk hantering i datacenter, där kylsystem används direkt på processorer och annan hårdvara som genererar värme.
Genom att placera kylkomponenterna närmare värmekällan förbättrar direktkylning av chipp – exempelvis via vätskekylning eller mikrofluidiska system – värmeavledningen och möjliggör mer exakt temperaturstyrning. Den här innovativa kylningsmetoden förbättrar inte bara servrarnas övergripande prestanda och tillförlitlighet utan gör även att datacentret kan ha en högre effektdensitet.
Direkt-till-chipp-kylning spelar en avgörande roll för att optimera energieffektiviteten, sänka kylkostnaderna och maximera datorkapaciteten inom befintliga ytor. I takt med att datacenter utvecklas blir direkt-till-chipp-kylning en nyckellösning för hållbar och högpresterande databehandling.
Benefits of Direct-to-Chip Cooling in Data Centres
Liquid cooling through Coolant Distribution Units (CDUs) has revolutionized cooling performance in data centers, offering unparalleled efficiency and enhanced thermal management capabilities.
By utilizing liquid as a cooling medium, CDUs facilitate the transfer of heat more effectively than traditional air cooling methods, allowing for greater heat dissipation and improved temperature regulation.
This advanced cooling technology not only optimizes the thermal management of servers and equipment but also enables data centers to operate at higher power densities without compromising performance or reliability.
To fully realize the benefits of direct-to-chip cooling, advanced infrastructure is required. Coolant Distribution Units (CDUs) are the workhorses of this ecosystem. They safely and precisely isolate the facility water loop from the IT equipment cooling loop, ensuring that the massive heat loads generated by clusters of NVIDIA GB300s or AMD Helios chips are efficiently rejected without compromising the safety of the server racks.
We recommend establishing direct-to-chip cooling as a core data centre strategy. The advantages of deploying this technology extend far beyond simply managing temperatures:
- Enabling technologies such as CDUs and liquid cooling support the operation of incredibly high-density racks.
- The strategy significantly improves overall data centre energy efficiency.
- Liquid loops enhance hardware reliability by maintaining consistent operating temperatures.
- This cooling method is critical for enabling intensive AI and HPC workloads.
KYLNING OMDEFINIERAD MED INNOVATIV DIREKTKYLNING
Direct-to-chip cooling offers a host of benefits that significantly enhance the thermal management and efficiency of data centers. By delivering cooling directly to heat-generating components at the chip level, this innovative approach maximizes heat dissipation efficiency and enables precise temperature control, resulting in improved performance and reliability of servers and hardware.
Direct-to-chip cooling systems also facilitate higher power densities, allowing data centers to operate at increased computational capacities within the same physical footprint. Additionally, this method reduces cooling energy consumption, lowers operational costs, and enhances the overall sustainability of data center operations.
By harnessing the advantages of direct-to-chip cooling, data centers can achieve superior thermal management, optimize energy efficiency, and bolster the performance and longevity of their infrastructure.
Direct-to-chip innovation relies on custom-engineered cold plates that physically attach to the hottest components of your server—the CPU and GPU dies. For systems like the NVIDIA GB200 NVL72, where dozens of GPUs operate in a tightly integrated architecture, micro-channel cold plates capture heat instantaneously at the source. This targeted approach dramatically reduces the need for power-hungry server fans and oversized computer room air conditioning (CRAC) units.
Coolant Distribution Units (CDUs) for Direct-to-Chip Cooling
The precision control and efficiency of liquid cooling systems through CDUs have significantly contributed to reducing energy consumption, minimizing carbon footprint, and maximizing the overall cooling performance of modern data centers, making them a cornerstone of sustainable and high-performance computing infrastructures.
To establish the proper product category, it is vital to understand the systems that drive the fluid through the cold plates. The CDU is the heart of any direct-to-chip liquid cooling deployment, managing flow rates, pressure, and coolant temperatures to ensure optimal thermal transfer from high-wattage silicon
Future of Coolant distribution units & Direct to chip 1MW rack incoming!
RackChiller CDU800 Coolant Distribution Unit
FUNKTIONER
- Redundant högpresterande, läckagefritt pumpsystem med
integrerade varvtalsreglerare - Kylvätskeanslutningar genom den övre eller nedre panelen
- Inbyggd 10-tumspekskärmsdisplay.
- Fjärrstyrningsfunktioner via Ethernet, SNMP v3 och Modbus
- Inbyggd läckageidentifiering
- Oöverträffad effekttäthet – kan monteras i standarddatacenter
- Service kan utföras under drift – systemet behöver inte stängas av under systemunderhåll.
- Redundant systemuppbyggnad minimerar risken för enstaka felkällor.
- Kan integreras med nVent Guardian Management Gateway och vårt sensorsortiment.
SPECIFIKATIONER
Allmänna data
- Kylkapacitet på mer än 800 kW vid 6K (850 LPM för den primära kretsen)
- Röranslutning: 3-tums hygienisk tri-klämma (ID)
Vätskans temperaturintervall: 20–70 °C (68–158 °F)
Primär klassning
- Kylvätska: behandlat vatten med upp till 20 % PG
- Maximalt tillåtet flöde: 1 200 LPM (317 GPM) •
- Maximalt tryckfall (vid 850 L/min, vatten): 1,3 bar (19 psi)
- Maximalt systemtryck: 10,3 bar (150 psi)
- Systemvolym: 50 liter
Primärfilterstorlek: 250 mikrometer
Sekundär kapacitet
- Kylvätska: Behandlat vatten med upp till 30 % PG
- Maximalt flöde (enkel pump): upp till 1100 LPM (290 GPM) vid 2,6 bar (38 psi)
- Maximalt flöde (dubbla pumpar): Upp till 1 100 LPM (290 GPM) vid 3,4 bar (49 psi)
- Maximalt tillåtet statiskt tryck: 3,5 bar (50 psi)
- Maximalt systemtryck: 8,6 bar (125 psi)
- Öppningstryck för tryckavlastningsventil: 9,0 bar (130 psi)
- Systemvolym: 100 liter
- Sekundärfilterstorlek: 50 mikrometer
Videofilmer
